Brief: Discover the SME-8200 Spray Cleaning Equipment, an advanced solution for wafer and chip level packaging processes. This automatic cleaning machine efficiently removes water-based flux and contaminants with a capacity of 100 wafers per hour. Featuring Kevlar transport nets and high-pressure water cleaning, it ensures precision for FCBGA/FCCSP semi chips. Ideal for industrial applications with 380V/50Hz power supply.
Related Product Features:
Automatic cleaning device for water-based flux and contaminants with a capacity of 100 wafers per hour.
Uses Kevlar transport nets for smooth and efficient movement of components.
High flow amount and high-pressure water for precise cleaning of FC packaging chips.
Compact design (8250*1970*1770mm) for easy integration into production lines.
DI water resistivity monitoring system ensures consistent cleaning quality.
Cleaning pressure adjustable between 3~8kg/cm2 for efficient and effective cleaning.
SUS304 Stainless Steel material for durability and longevity.
SMEMA lines to connect upstream and downstream equipment seamlessly.
Câu hỏi thường gặp:
What is the cleaning capacity of the SME-8200 Spray Cleaning Equipment?
The SME-8200 has a cleaning capacity of 100 wafers per hour, making it ideal for high-volume industrial applications.
What type of power supply does the SME-8200 require?
The SME-8200 operates on a 380V/50Hz power supply, designed to meet industrial cleaning demands.
Can the SME-8200 be customized for specific cleaning needs?
Yes, the SME-8200 offers customization options including air blow + hot air dry systems and high-pressure water for precise FC packaging chips cleaning.
What materials are used in the construction of the SME-8200?
The SME-8200 is constructed with SUS304 Stainless Steel, ensuring durability and resistance to corrosion in industrial environments.